voidless-hermetically-sealed surface mount unidirectional transient suppressors www. microsemi . scottsdale division microsemi scottsdale division page 1 copyright ? 2007 10-03-2007 rev d com 1n6469us thru 1n6476us 1n6469us ? 1n6476us description appearance this surface mount series of industry recognized voidless- hermetically-sealed unidirectional transient voltage suppressor (t vs) designs is military qualified to mil- prf-19500/552 and are ideal for high-reliabilit y applications where a failure cannot be tolerated. they provide a working peak ?s tandoff? voltage selection from 5.0 to 51.6 volts with 1500 w ratings. they are very robust in hard-glass construction and also use an internal metallurgical bond identified as category i for high reliability applications. the 1500 w series is militar y qualified to mil-prf-19500/552. these devices are also available in axial-leaded packages for thru-hole mounting by deleting the ?us? suffix (see separate data sheet for 1n6469 thru 1n6476a). microsemi also offers numerous other tvs products to me et higher and lower peak pulse power and voltage ratings in both through-hole and surface-mount packages. package ?g? (or ?d-5c?) important: for the most current data, consult microsemi?s website: http://www.microsemi.com features applications / benefits ? high surge current and peak pulse power provides transient voltage protection for sensitive circuits ? triple-layer passivation ? internal ? category i? metallurgical bonds ? voidless hermetically sealed glass package ? jan/tx/txv military qualif ications available per mil- prf-19500/552 by adding jan, jantx, or jantxv prefix ? further options for screening in accordance with mil- prf-19500 for jans by using a ?sp? prefix, e.g. sp6469, sp6476, etc. ? axial-leaded equivalents are also available (see separate data sheet for 1n6469 thru 1n6476) ? military and other high re liability transient protection ? extremely robust construction ? working peak ?standoff? voltage (v wm ) from 5.0 to 51.6 v ? available as 1500 w peak pulse power (p pp ) ? esd and eft protection per iec61000-4-2 and iec61000-4-4 respectively ? secondary lightning protection per select levels in iec61000-4-5 ? square-end-cap terminals for easy mounting ? nonsensitive to esd per mil-std-750 method 1020 ? inherently radiation hard as described in microsemi micronote 050 maximum ratings mechanical and packaging ? operating & storag e temperature: -55 o c to +175 o c ? peak pulse power at 25 o c: 1500 watts @ 10/1000 s (also see figures 1,2 and 4) ? impulse repetition rate (duty factor): 0.01% ? forward surge current: 130 amps@ 8.33 ms one- half sine wave ? forward voltage: 1.5 v @ 4 amps dc and 4.8 v at 100 amps (pulsed) ? steady-state power: 3.0 w @ t a = 25 o c (see note below and figure 4) ? thermal resistance junction to end cap: 20.0 o c/w ? solder temperatures: 260 o c for 10 s (maximum) ? case: hermetically se aled voidless hard glass with tungsten slugs ? terminations: end caps are copper with tin/lead (sn/pb) finish. note: previous inventory had solid silver end caps with tin/lead (sn/pb) finish. ? marking: body painted and part number, etc. ? polarity: cathode band ? tape & reel option: standard per eia-481-b ? weight: 1100 mg ? see package dimensions on last page note: steady-state power ratings with reference to am bient are for pc boards where thermal resistance from mounting point to ambient is sufficiently controlled where t j(max) is not exceeded. 8700 e. thomas rd. po box 1390, scottsdale, az 85252 usa, (480) 941-6300, fax: (480) 947-1503
voidless-hermetically-sealed surface mount unidirectional transient suppressors www. microsemi . com scottsdale division 1n6469us thru 1n6476us 1n6469us ? 1n6476us electrical characteristics type break down voltage v(br) min. breakdown current i (br) working peak voltage v wm max leakage current i d maximum clamping voltage v c @ 10/1000 s maximum peak pulse current i pp @8/20 s @10/1000 s maximum temp. coef. of v (br) volts madc vdc adc v(pk) a(pk) a(pk) %/ o c 1n6469us 5.6 50 5 1500 9.0 945 167 -.03, +0.04 1n6470us 6.5 50 6 1000 11.0 775 137 0.06 1n6471us 13.6 10 12 20 22.6 374 66 0.085 1n6472us 16.4 10 15 10 26.5 322 57 0.085 1N6473US 27.0 5 24 5 41.4 207 36.5 .096 1n6474us 33.0 1 30.5 5 47.5 181 32 .098 1n6475us 43.7 1 40.3 5 63.5 135 24 .101 1n6476us 54.0 1 51.6 5 78.5 107 19 .103 symbols & definitions symbol definition v br minimum breakdown voltage: the minimum volt age the device will exhibit at a specified current. v wm working peak voltage: the maximum peak voltage that can be applied over the operat ing temperature range. this is also referred to as standoff voltage. i d maximum standoff current: the maximum current that wi ll flow at the specified voltage and temperature. v c maximum clamping voltage at specified i pp (peak pulse current) at the specified pulse conditions. p pp peak pulse power: the peak power dissipation resulting from the peak impulse current i pp . graphs pulse current (i p ) in percent of i pp peak value i pp pulse time duration (tp) is defined as that point where i p decays to 50% of peak value (i pp ). time (t) in milliseconds fig. 1 ? non-repetive peak pulse power rating curve fig. 2 pulse wave form for exponential surge note: peak power defined as peak vo ltage times peak current for 10/1000 s microsemi scottsdale division page 2 copyright ? 2007 10-03-2007 rev d 8700 e. thomas rd. po box 1390, scottsdale, az 85252 usa, (480) 941-6300, fax: (480) 947-1503
voidless-hermetically-sealed surface mount unidirectional transient suppressors microsemi scottsdale division 8700 e. thomas rd. po box 1390, scottsdale, az 85252 usa, (480) 941-6300, fax: (480) 947-1503 page 3 www. microsemi . com scottsdale division 1n6469us thru 1n6476us 1n6469us ? 1n6476us figure 3 t ? temperature ? o c peak pulse power (ppp), current (ipp), and dc power in percent of 25 o c ratin g 8/20 s current impulse waveform figure 4 derating curve package dimensions inches [mm] g-melf-pkg (d-5c) shown in the pad layout. note: if mounting requires adhesive separate from the solder, an additional 0.090 inch diameter contact may be placed in the center between the pads as an optional spot for cement as copyright ? 2007 10-03-2007 rev d
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